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About "Cross-edge" microprocessing

Product search by end-user market

Industrial
laser
  Optical
communication
  Projector   AV/Mobile   Biotechnology/
Medical
  Semiconductors   Digital
equipment
  Automotive
 
 

Industrial laser

■Applications
・Laser equipment for welding, cutting, marking, surface treatment(e.g. annealing), etc
・Medical laser equipment for ophthalmology and epilation, and endoscopes
 
CuW submount
CuW submount
Heat sink with high electric conductivity leading to the increase in the LD module power
details
 
Insulation type Cu-AlN-Cu submount
Insulation type Cu-AlN-Cu Submount
Cu-AlN-Cu composite-type submount with high thermal conductivity leading to the decrease in thermal stress to LD. Insulation type
details
 
Microchannel cooler
Microchannel cooler
New-structured microchannel heat sink leading to a longer life of the high power LD module
details
 
High pressure seamless microchannels
High pressure Seamless microchannels
Original method of forming microchannels in single solid metal resulting in high pressure-resistance microchannels
details
 
Mounts / Carriers
Mounts / Carriers
With our “ Cross-edge ” microprocessing technology, any type of carrier can be manufactured according to the customers’ requirements
details
PAGETOP
 

Optical communication

■Applications
・Transmitters, Optical transceivers, Optical amplifiers (for pumping)
 
Mounts / Carriers
Mounts / Carriers
With our “ Cross-edge ” microprocessing technology, any type of carrier can be manufactured according to the customers’ requirements
details
PAGETOP
 

Projector

■Applications
・Display devices for projectors
 
Spacer glass
Spacer glass
Suitable for multilayer packaging by combining with semiconductor wafers such as MEMS devices.
details
 
Cavity glass / Cap glass
Cavity glass / Cap glass
Hi-precision cavity can be formed inside of the glass wafer. Transparent and thinner finish is available on the cavity bottom
details
   
PAGETOP
 

AV/Mobile

■Applications
・RF-switches/relays for mobile devices such as smartphones, portable video games, digital cameras, car navigation systems,
Pressure sensors, Gyroscopes, Acceleration sensors, image sensors
 
Through glass via (TGV)
Through glass via (TGV)
Most suitable for miniaturizing semiconductor devices. The metal via can improve the high-frequency properties of the devices
details
 
Cavity glass / Cap glass
Cavity glass / Cap glass
Hi-precision cavity can be formed inside of the glass wafer. Transparent and thinner finish is available on the cavity bottom
details
 
Spacer glass
Spacer glass
Suitable for multilayer packaging by combining with semiconductor wafers such as MEMS devices.
details
■Applications
・Display devices for mobile devices such as smartphones, portable video games, digital cameras, Display devices for pico-projectors
 
Cavity glass / Cap glass
Cavity glass / Cap glass
Hi-precision cavity can be formed inside of the glass wafer. Transparent and thinner finish is available on the cavity bottom
details
■Applications
・Cover glass for smartphones
 
Chemically-strengthened glass
Chemically-strengthened glass
Can be used in the lamination processing of substrate glass for one-glass-solution (OGS) type touch panels.
details
PAGETOP
 

Biotechnology/Medical

■Applications
・Analytical chips for DNA/drug-discovery-screening analyzers

・Microreactors for biochemical reaction/electrophoresis analyzers

・Bioreactors for chemical sensors, microorganism-detection sensors
・Industrial gas-detection sensors

 
Spacer glass
Spacer glass
Suitable for multilayer packaging by combining with semiconductor wafers such as MEMS devices.
details
 
Microfluidic glass
Microfluidic glass
Microfluidic glass products with excellent thermal and chemical resistance. The microfluidic channels can be flexibly designed in 3 dimensions.
details
   
■Applications
・Mixing devices, Reacting devices
・Analytical devices, micro sprays
・Local-cooling devices
 
High pressure Seamless microchannels
High pressure Seamless microchannels
Original method of forming microchannels in single solid metal resulting in high pressure-resistance microchannels
details
■Applications
・Pressure sensors for medical devices
 
Through glass via (TGV)
Through glass via (TGV)
Most suitable for miniaturizing semiconductor devices. The metal via can improve the high-frequency properties of the devices
details
PAGETOP
 

Semiconductors

■Applications
・Power semiconductor devices, MPU (Microprocessing units)
 
CuW submount
CuW submount
Heat sink with high electric conductivity leading to the increase in the LD module power
details
 
Insulation type Cu-AlN-Cu submount
Insulation type Cu-AlN-Cu Submount
Cu-AlN-Cu composite-type submount with high thermal conductivity leading to the decrease in thermal stress to LD. Insulation type
details
   
■Applications
・RF-MEMS switches
・Image sensors
 
Through glass via (TGV)
Through glass via (TGV)
Most suitable for miniaturizing semiconductor devices. The metal via can improve the high-frequency properties of the devices
details
 
Micro-hole glass
Micro-hole glass
Leads to the miniaturization of devices in combination with semiconductors/electronic parts
details
 
Cavity glass / Cap glass
Cavity glass / Cap glass
Hi-precision cavity can be formed inside of the glass wafer. Transparent and thinner finish is available on the cavity bottom
details
 
Spacer glass
Spacer glass
Suitable for multilayer packaging by combining with semiconductor wafers such as MEMS devices.
details
PAGETOP
 

Digital equipment

■Applications
・Laser printers, Digital multifunction-printers
 
CuW submount
CuW submount
Heat sink with high electric conductivity leading to the increase in the LD module power
details
 
Insulation type Cu-AlN-Cu submount
Insulation type Cu-AlN-Cu Submount
Cu-AlN-Cu composite-type submount with high thermal conductivity leading to the decrease in thermal stress to LD. Insulation type
details
 
Mounts / Carriers
Mounts / Carriers
With our “ Cross-edge ” microprocessing technology, any type of carrier can be manufactured according to the customers’ requirements
details
PAGETOP
 

Automotive

■Applications
・Pressure sensors, Acceleration sensors
・Gyroscopes
 
Through glass via (TGV)
Through glass via (TGV)
Most suitable for miniaturizing semiconductor devices. The metal via can improve the high-frequency properties of the devices
details
 
Micro-hole glass
Micro-hole glass
Leads to the miniaturization of devices in combination with semiconductors/electronic parts
details
 
Cavity glass / Cap glass
Cavity glass / Cap glass
Hi-precision cavity can be formed inside of the glass wafer. Transparent and thinner finish is available on the cavity bottom
details
 
Spacer glass
Spacer glass
Suitable for multilayer packaging by combining with semiconductor wafers such as MEMS devices
details
■Applications
・LED
 
Cavity glass / Cap glass
Cavity glass / Cap glass
Hi-precision cavity can be formed inside of the glass wafer. Transparent and thinner finish is available on the cavity bottom
details
 
Spacer glass
Spacer glass
Suitable for multilayer packaging by combining with semiconductor wafers such as MEMS devices
details
   
 
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