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Product search by microprocessing technologies

Technologies of TECNISCO

Below is the list of our Cross-edge microprocessing technologies
 
Cutting/Grinding/Polishing
It is possible to machine cutting-resistant metals such as CuW, Kv, Ag, Mo, or Cu, and brittle materials such as glass. We are very good at microprocessing of products from a square shape of 200 μm on one side to a few millimeters.
 
■Main processing technologies
Metal
Burr-less/sharp edge metal processing
Microfluidic-structured heat sink
 
Glass
No chipping glass processing
Drilling
Sandblasting
Ultrasonic-wave drilling
Special polishing
Transparent finish on the cavity bottom
Microfluidic glass
Special microprocessing
 
details
 
 
Metalizing
Various metallization such as sputtering, vapor deposition, and plating can be processed on an even/uneven surface according to customers’ needs.
 
■Main processing technologies
Sputtering
Vapor deposition
Plating
 
details
 
 
Bonding
We can meet customers’ needs as a one-stop service using our variety of bonding technologies.
 
■Main processing technologies
Assembled parts with metal and insulated ceramic by solder
Cu-Mo-Cu forming into 1.6 mm thickness
 
Conductive-through-metal-via processing
Anodic bonding of glass to silicon
 
details
 
 
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