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About "Cross-edge" microprocessing

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TECNISCO will participate in 16th IC Packaging Technology Expo

We will be looking forward to seeing you there!

Dates :  January 14th(Wed) - 16th(Fri), 2015

  10 am - 6 pm (Will close at 5 pm on 16th)

Venue:  Tokyo Big Sight Booth No. East 41-20

For more information, please refer to the 16th IC Packaging Technology Expo Website.