HOME > News ReleaseEvent Schedule17th IC PACKAGING TECHNOLOGY EXPO

Product

  • Product search by Category
  • Product search by end-user market
  • Search by purpose
  • Search by microprocessing technologies
About "Cross-edge" microprocessing

 

17th IC PACKAGING TECHNOLOGY EXPO


 

   

TECNISCO will participate in 17th IC PACKAGING TECHNOLOGY EXPO

We will be looking forward to seeing you there!

Dates :  Jan. 13[Wed] - 15[Fri], 2016

  10:00 - 18:00 (Last day until 17:00)

Venue:  Tokyo Big Sight, Japan

              Booth No. E53-34

For more information, please refer to the 17th IC Packaging Technology Expo Website.