HOME > Product search by purpose

Product

  • Product search by Category
  • Product search by end-user market
  • Search by purpose
  • Search by microprocessing technologies
About "Cross-edge" microprocessing

Product search by purpose

Metal products

Heat sinks suitable for cooling LD (laser diode)
Microchannel cooler
CuW submount
Insulation type Cu-AlN-Cu submounts
Mounts / Carriers
Heat sinks CTE (coefficient of thermal expansion)-matched with LD
Microchannel cooler
CuW submount
Insulation type Cu-AlN-Cu submounts
Thermal-stress-proved Cu-AlN-Cu substrates with better results in the thermal cycle test Insulation type Cu-AlN-Cu submounts
Versatile heat sinks such as C-mount, B-mount, Q-mount or CS-mount Mounts / Carriers
Heat sinks for cooling laser diode for high-intensity LED High pressure seamless microchannels
Water-cooling heat sinks
Microchannel cooler
High pressure seamless microchannels
Insulation-type heat sinks Insulation type Cu-AlN-Cu submounts
Heat sinks which can be easily aligned with LD
CuW submount
Insulation type Cu-AlN-Cu submounts
Heat sinks on a request-basis
Microchannel cooler
CuW submount
Insulation type Cu-AlN-Cu submounts
High pressure seamless microchannels
Mounts / Carriers
High-pressure-gas- or water-cooling heat sinks High pressure seamless microchannels
Controlling the wetting of overlapping amount of AuSn solder
CuW submount
Insulation type Cu-AlN-Cu submounts
Preventing solder balls (pearl) in the reflow process.
Microchannel cooler
CuW submount
Insulation type Cu-AlN-Cu submounts
Mounts / Carriers
Heat sinks suitable for P-side-down-type LD.
Microchannel cooler
CuW submount
Insulation type Cu-AlN-Cu submounts
Mounts / Carriers
Vapor deposition service of AuSn solder
Microchannel cooler
CuW submount
Insulation type Cu-AlN-Cu submounts
Mounts / Carriers
High-pressure-resistance / better-reliability type water-cooling heat sinks. High pressure seamless microchannels
Light and small size water cooling heat sinks. High pressure seamless microchannels
Microreactors made of metal High pressure seamless microchannels
 
PAGETOP
 

Glass products

For miniaturizing a device or package TGV
For increasing the number which can be made from a single wafer
TGV
Micro-hole glass
Cavity glass / Cap glass
Mesh glass
Spacer glass
For enhancing the yield of anodic bonding process
TGV
Micro-hole glass
Cavity glass / Cap glass
Mesh glass
Spacer glass
For evaluating the inside of a device Cavity glass / Cap glass
For preventing particles from the surface in processing
Micro-hole glass
Cavity glass / Cap glass
Mesh glass
Spacer glass
Microfluidic glass
Glass CTE (coefficient of thermal expansion)-matched with silicon
TGV
Micro-hole glass
Cavity glass / Cap glass
Mesh glass
Spacer glass
Microfluidic glass
Glass with electric contact via TGV
Glass for a filter or mesh Mesh glass
Non-chipping glass in processing
TGV
Micro-hole glass
Cavity glass / Cap glass
Mesh glass
Spacer glass
Microfluidic glass
Glass with better bondability to silicon (Less slope around the holes for enlarging Si-Glass bonding area)
TGV
Micro-hole glass
Cavity glass / Cap glass
Mesh glass
Spacer glass
Microfluidic glass
For controlling the straightness or taper of hole shapes
Micro-hole glass
Cavity glass / Cap glass
Mesh glass
Spacer glass
Microfluidic glass
Glass with better tolerance in processing
TGV
Micro-hole glass
Cavity glass / Cap glass
Mesh glass
Spacer glass
Microfluidic glass
Glass which can be easily aligned with a silicon device
TGV
Micro-hole glass
Cavity glass / Cap glass
Mesh glass
Spacer glass
Microfluidic glass
Glass for interposers Spacer glass
Glass with rectangular holes with almost zero round corners Mesh glass
Non-chipping glass without being polished
TGV
Micro-hole glass
Cavity glass / Cap glass
Mesh glass
Spacer glass
Microfluidic glass
Glass with patterned Cu metal
TGV
Micro-hole glass
Glass for packaging and shielding a device
Cavity glass / Cap glass
Mesh glass
Spacer glass
Mesh glass embedded with a device for equipment Mesh glass
 
PAGETOP
 
Inquiry