CuW submounts|TECNISCO, LTD
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CuW submounts

Outline

CuW submounts   This CuW submount is used as a heat sink for high power LD modules. Alignment with LD, and sharp edge and control of warpage for effective thermal conductivity are available.
Redundant solder can be controlled in AuSn vapor deposition on the LD bonding area.
 
 

Features

Materials
Composition W90/Cu10
Thermal conductivity 170W/m・K
CTE (coefficient of thermal expansion) 6.5ppm/℃
 
Dimension/Tolerance
Length Refer to the right table
Width
Thickness
Surface roughness Ra<0.4
Warpage < 5.0μm
Edge radius < 20.0μm
 
Metallization
All surface Ni 1.0-5.0μm/Au 0.1-0.3μm
 
AuSn solder
Composition Au75/Sn25(wt%)
Thickness 5μm ±1μm
 
Options
Material selection(W80 / Cu20)
Sputtering layer(Ti, Pt, Au etc.)
Additional structure (Hole, Step)
 
Note: These are standard specifications.
In case you have any request other than the above, please feel free to contact us.
 
CuW submounts
CuW submounts
Enlarged view
 
 
Standard specifications(Unit:mm)
CuW submounts
 
Length(±0.05)Width(±0.05)Thickness(±0.02)
10.6 2.0 0.20
0.25
0.30
0.40
3.0
4.0
5.6 5.6
 
 

End user market / Applications

Industrial laser
・Laser equipment for welding, cutting, marking,
surface treatment(e.g. annealing), etc
・Medical laser equipment for ophthalmology and epilation, and endoscopes,etc

 
Semiconductors
・Power semiconductor devices, MPU (Microprocessing units),etc
 
Digital equipment
・Laser printers, Digital multifunction-printers,etc
 
 
 
 
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