Cutting/Grinding/Polishing
|
|
|
|
| Burr-less/sharp edge processing for cutting-resistant metals such as CuW, Kovar, Cu is available. |
| ・Sharp edge: 5 μm radius max. (Au plating is available) |
| ・Surface roughness (actual measurement average) : Ra 0.38 μm |
| |
 |
| |
| |
| |
| Length（±0.05） | Width（±0.05） | Widt（±0.02） |
|---|
| 10.6 |
2.0 |
0.20
0.25
0.30
0.40 |
| 3.0 |
| 4.0 |
| 5.6 |
5.6 |
|
| CuW submounts（Standard product size） |
|
|
|
| |
|
|
|
 |
| Side view of CuW submounts (3 pieces) and its enlarged view |
|
Front view |
|
| |
| |
| |
Products processed by this technology
|
|
|
| |
 |
| |
|
Microfluidic-structured heat sink
|
| Standard processing to make channels inside the metal is to first process two parts separately and then bond them together by solder or thermal diffusion. However, our seamless microchannels are processed with our original manufacturing method, which results in a completely seamless structure without bonding layers. This enhances high-pressure resistance inside the channels. Minimum width of the microchannels is 20 μm. |
| |
 |
0.9 mm thick, Cu monolithic structure
|
| |
 |
|
| |
| |
| |
Products processed by this technology
|
|
|
| |
| |
| |
|
|
|
| Drilling |
| ・ |
We develop special drills for glass processing, and can process micro holes of ø0.2 mm for mass production and ø0.05 mm for trial manufacture. |
| ・ |
It is possible to process rectangular cavity. |
|
| |
| Micro through hole processing |
 |
|
|
| Microgroove processing |
 |
|
|
| Cross section of microgroove processing |
 |
|
|
| |
|
| Sandblasting |
| ・ |
Flexible pattern processing is available at a lower cost. |
| ・ |
High cumulative pitch tolerance is available. |
| ・ |
No chipping processing prevents chipping around the holes. |
|
| |
| No chipping sandblasting |
|
Conventional sandblasting |
 |
|
 |
|
| |
|
| Ultrasonic-wave drilling |
| ・ |
Collective hole drilling is available on a glass wafer of 4 mm thick max. |
| ・ |
Simultaneous hole drilling is available on a glass wafer anodic-bonded to a silicon wafer. |
|
| |
|
|
| |
| |
| |
Products processed by this technology
|
|
|
| |
