Spacer glass|TECNISCO, LTD
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Spacer glass

Outline

Spacer glass   Suitable for multilayer packaging by combining with semiconductor wafers such as MEMS devices.
 
 

Features

Wafer image
 
Improve bonding yield with device wafers
● Control sagging around the holes
● Minimize chipping size
  ・≦10μm is available
 
Options
●Remove microcracks from machined surface to control the particles
   ・Prevent malfunctions in bonding with MEMS devices
 
Standard specifications
Material Glass
Glass size ≦φ200mm
Min. thickness 0.15mm
Thickness tolerance ±0.01mm
Min. hole size φ0.3mm
Window shape upon request
Window size tolerance ±0.02mm
Chipping size ≦100μm
Cross-section shape Straight / Taper / Step
Metallization process Available
Note: These are standard specifications.
In case you have any request other than these, please feel free to contact us.
 
Fig. A B arrow Fig. A B   Illustration
 
 

End user market / Applications

Projector
・Display devices for projectors,etc
 
AV/Mobile
・RF-switches/relays for mobile devices such as smartphones, portable video games, digital cameras, car navigation systems,
 
Biotechnology/Medical
・Analytical chips for DNA/drug-discovery-screening analyzers,etc
・Microreactors for biochemical reaction/electrophoresis analyzers,etc
・Bioreactors for chemical sensors, microorganism-detection sensors,etc
・Industrial gas-detection sensors,etc
 
 
Semiconductor
・RF-MEMS switches.
・Image sensors,etc
 
Automotive
・Pressure sensors, Acceleration sensors.
・Gyroscopes,etc
・LED,etc
 
 
 
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