Metallizing
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Sputtering
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| Patterned metallization is available on glass, ceramic, silicon, etc, by sputtering. |
| ・Sputtering layers: Ti/Pt/Au, Cr/Pt/Au, Cr/Ni/Au |
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| Metallization on ceramic |
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Glass wafer
Before (left) and after sputtering |
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Products processed by this technology
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Vapor deposition
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| AuSn vapor deposition is available on all kinds of products, not only single metal/ceramics, but also assembled parts. It can lead to high-quality bonding to LD laser, resulting in a longer life of customers’ products. |
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| Microchannel cooler |
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Mounts / Carriers |
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Products processed by this technology
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Plating
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| Patterned metallization is available on glass, ceramic, silicon etc. |
| ・Local plating or plating even/uneven surface of Au or Cu is available. |
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| Through-via made by sandblasting can be a metal via when sputtered and plated, and seal silicon devices. |
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Metallization + Bump |
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Products processed by this technology
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