Tecnisco Advanced Materials (TAM)
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Metal diamond composites
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This material features an excellent thermal conductivity and a relatively low thermal expansion that no past materials were capable of. Combining our conventional ingenious technology and experience, we have succeeded in creating a long-lasting, reliable material beneficial for high power applications. |
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Features
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Metal diamond composites make a significant contribution to improving product performance and reliability as well as extending the lifetime by offering: ● Excellent thermal conductivity ● CTE well adapted to packaging materials ● Easy integration of components into existing packages
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Standard dimensions |
Thickness |
1.0-5.0mm |
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Length |
Up to 200mm |
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Width |
Up to 200mm |
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Surface Finish Process |
Surface Roughness |
Ra<0.01μm * |
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Flatness |
<1μm * |
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Metallization |
Cu, Ag |
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Coating |
Ni, Ni/Au, Ag, Cu, AuSn |
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*after coating + diamond milling |
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End user market / Applications
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Micro Electronics |
・Server CPU |
・Premium Coolers |
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HF Electronics |
・Wireless Communication |
・Data Broadcast |
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Power Electronics |
・Battery Cooling System |
・Electric Vehicle |
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Medical |
・X-ray |
・Medical RF imaging |
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Other service
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Vacuum hot press service
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Sputtering Targets Laminated materials Customized to customers' request ・Shape ・Thickness ・Various materials |
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Singapore factory
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TECNISCO Advanced Materials Pte Ltd |
No.70 Tuas South Street5 Singapore 637806 |
Phone:+65-6515-9138 / Fax:+65-6515-9183 |
Access Map |
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