Any type of carriers from C-mount to full-customized carriers can be manufactured according to the customers’ requirements. Our “ Cross-edge ” microprocessing including cutting, plating, vapor deposition, and bonding, gives you a one-stop solution.
Features
Standard dimensions
Materials
Body
Cu（OFHC）/CuW10
Lead
Kv
Ceramic
Al203（92-96%）
Note: OFHC
Oxygen-free high thermal conductivity
Dimension/Tolerance
Length
upon request (Refer to A to L in the right figure)
Width
Thickness
Surface roughness
Ra<0.4
Burr
5μm以下
Edge Radius
①< 10μm ②< 50μm ③< 80μm
Metallization
All surface
Ni 1-5μm/Au 0.1-0.3μm
Options
AuSn vapor deposition
Diamond turning process (only for Cu type)
Note: These are standard specifications. In case you have any request other than the above, please feel free to contact us.
Dimensions image（unit：mm）
End user market / Applications
Industrial laser
・ Laser equipment for welding, cutting, marking, surface treatment(e.g. annealing), etc ・ Medical laser equipment for ophthalmology and epilation, and endoscopes,etc
